Studying the Effect of Thickness on the Properties of Ti-6Al-4V Films Prepared by Magnetron Sputtering Plasma Deposited on Stainless Steel Substrates
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Abstract
In this study, magnetron sputtering was used to deposit Ti-6Al-4V thin films onto stainless steel substrates. A high-purity (99%) Ti-6Al-4V target and a DC magnetron sputtering system were employed. Deposition occurred at a base pressure of 10⁻5 bar, a working pressure of 4 Torr, room temperature (27 °C), and a target-to-substrate distance of 5 cm. Film thickness was controlled by varying deposition time to 3, 6, and 9 minutes. AFM and FESEM analyses showed thicknesses of 18, 42, and 13 nm for the first, second, and third samples, respectively. AFM revealed that the 18 nm sample had a smooth, uniform surface, while the 42 nm and 13 nm films showed poorer surface quality and structural changes. FESEM indicated that nanoparticle size and surface morphology varied with thickness. A clean surface was observed in the 18 nm film, whereas the 42 nm and 13 nm samples exhibited irregular deposition profiles and particle-size differences. Controlling film thickness during deposition is essential for achieving desired properties. Mechanical and electrical behavior change significantly with thickness and surface structure. Thinner films show modified optoelectronic and mechanical characteristics due to increased surface aggregation. Surface variations are crucial for sensor and electronic device development. Ti-6Al-4V films produced by magnetron sputtering exhibited nanoparticles of 33–43 nm and improved corrosion resistance, mechanical durability, thermal stability, and optical performance. These properties make them suitable for sensors, microdevices, and electronic medical applications. Furthermore, precise thickness optimization enables tailored functionality for advanced coatings, biomedical implants, and durable electronic surface engineering solutions worldwide.
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